±0.5mm Execution Precision with Vision System
Electrostatic Discharge (ESD) Protection with Multiple Safety Features
Graphical Programming for Easy Operation
Modular System for Quick Integration
| Dimensions (L*W*H) | 841*540*1,000mm |
| Arm payload | 12kg |
| Maximum speed (no load) | 1.5m/s |
| Maximum speed (full load) | 1.0m/s |
| Positioning accuracy | ±10mm / ±1° |
| Material type | Magzine |
| Max. gap tolerance | ≤35mm |
| Max. ground elevation difference | ≤10mm |
Hybrid Navigation
Driving Mode
Execution Precision(mm)
Machine Vibration(g)
Arm Range(mm)
Runtime/Charge Time(h)
FOUP Handling
Through the coordinated operation of robotic arms and mobile platforms, automated transfer of wafer boxes between equipment and electronic component racks is effortlessly achieved.
Magzine Handling
By integrating laser SLAM navigation with visual positioning technology, the system achieves precise picking and placement of semiconductor wafer carriers, enabling automated material transfer.
Tray Handling
High-precision positioning capability enables accurate picking and placement of tray materials. Customizable grippers accommodate trays of various specifications and sizes.
Contact Us For The Latest Information On Amr
E-mail:
sales@iplusmobot.comPhone:
+86-400-100-6391Address:
Floor 1, Building 8, Jinsheng Tech. Park, 611 Dongguan Road, Puyan, Binjiang District, Hangzhou, ChinaOur AMR'S
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